? semiconductor components industries, llc, 2006 january, 2006 ? rev. 3 1 publication order number: mc10sx1190/d mc10sx1190 fibre channel coaxial cable driver and loop resiliency circuit description the mc10sx1190 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. it incorporates the output cable drive capability of the mc10ep89 coaxial cable driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. the multiplexer control circuitry is ttl compatible for ease of operation. the mc10sx1190 is useful as a bypass element for fibre channel-arbitrated loop (fc-al) or serial storage architecture (ssa) applications, to create loop style interconnects with fault tolerant, active switches at each device node. this device is particularly useful for back panel applications where small size is desirable. the ep89 style drive circuitry produces swings approximately 70% larger than a standard pecl output. when driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. the 1.4 v output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. because of the larger output swings, the qt, qt outputs are terminated into the thevenin equivalent of 50 to v cc ? 3.0 v instead of 50 to v cc ? 2.0 v. features ? 2.5 gb/s operation ? 425 ps propagation delay ? 1.4 v output swing on the cable driving output ? single positive supply operation ranges: v cc = 3.0 v to 3.6 v, v ee = 0 v v cc = 4.5 v to 5.5 v, v ee = 0 v ? 75 k internal input pull down resistors ? esd protection: 2000 v human body model, >100 v machine model ? these are pb ? free devices* 19 20 18 17 16 15 14 2 1 34567 v cc 13 8 v cc qr qr v ee dt dt v cc v ee dr dr v cc v cc qt qt v ee 12 9 11 10 v bb v ee sel v cc figure 1. 20-lead tssop pinout: (top view) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. tssop ? 20 dt suffix case 948e marking diagram sel function l h dr qt dt qt truth table pin description pin dr/dr qr/qr ecl buffered differential outputs from receive cable function ecl diff. inputs from receive cable dt/dt qt/qt ecl buffered differential output to transmit cable ecl differential input to transmit cable sel v bb reference voltage output ttl multiplexer control signal v cc ecl positive supply v ee ecl negative, 0 supply a = assembly location l = wafer lot y = year w = work week = pb ? free package (note: microdot may be in either location) *for additional marking information, refer to application note and8002/d. http://onsemi.com 10sx 1190 alyw see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information
mc10sx1190 http://onsemi.com 2 from input cable (ecl levels) local receive data (ecl levels) figure 2. logic diagram qr qr 1 0 dr dr qt qt dt dt sel (ttl) v bb local transmit data (ecl levels) to output cable (enhanced swing) table 1. absolute maximum ratings symbol parameter value unit v cc power supply voltage (v ee = 0 v) 0 to +6.0 vdc v ee power supply voltage (v cc = 0 v) ? 6.0 to 0 vdc v in input voltage (v ee = 0 v, v in not more positive than v cc ) 0 to +6.0 vdc v in input voltage (v cc = 0 v, v in not more negative than v ee ) ? 6.0 to 0 vdc i out output current continuous surge 50 100 ma ja thermal resistance (junction ? to ? ambient) still air 500 lfpm 90 60 c/w jc thermal resistance (junction ? to ? case) 30 to 35 c/w t a operating temperature range ? 40 to +85 c t stg storage temperature range ? 50 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected.
mc10sx1190 http://onsemi.com 3 table 2. dc characteristics (v cc = 3.3 v, v ee = 0 v) (note 1) symbol characteristic -40 c 25 c 85 c unit min typ max min typ max min typ max v oh output voltage high (qr,qr ) (note 2) 2.22 2.35 2.52 2.27 2.39 2.57 2.30 2.40 2.60 v v ol output voltage low (qr,qr ) (note 2) 1.35 1.54 1.65 1.37 1.57 1.67 1.40 1.57 1.71 v v oh output voltage high (qt,qt ) (note 3) 2.13 2.29 2.40 2.18 2.33 2.46 2.20 2.34 2.48 v v ol output voltage low (qt,qt ) (note 3) 0.50 0.67 1.10 0.48 0.64 1.06 0.44 0.63 1.06 v i cc quiescent supply current (note 4) 30 60 90 30 60 90 30 60 90 ma v ih input voltage high 2070 2410 2170 2490 2240 2580 mv v il input voltage low 1350 1800 1350 1820 1350 1860 mv v ih input voltage high sel (note 5) 2.0 2.0 2.0 v v il input voltage low sel (note 5) 0.8 0.8 0.8 v v bb output reference voltage (note 1) 1.80 1.90 2.05 1.80 1.90 2.05 1.85 1.95 2.05 v note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. input and output parameters will track 1:1 v cc . v ee can vary +0.3 v to ? 0.3 v. 2. qr outputs loaded with 50 to v cc ? 2.0 v 3. qt outputs loaded with 50 to v cc ? 3.0 v 4. outputs open circuited. 5. ttl signal threshold is 1.5 v above v ee . table 3. dc characteristics (v cc = 5.0 v, v ee = 0 v) (note 6) symbol characteristic -40 c 25 c 85 c unit min typ max min typ max min typ max v oh output voltage high (qr,qr ) (note 7) 3.92 4.05 4.22 3.97 4.09 4.27 4.0 4.10 4.30 v v ol output voltage low (qr,qr ) (note 7) 3.05 3.24 3.35 3.07 3.27 3.37 3.10 3.27 3.41 v v oh output voltage high (qt,qt ) (note 8) 3.83 3.99 4.11 3.88 4.03 4.16 3.90 4.04 4.18 v v ol output voltage low (qt,qt ) (note 8) 1.90 2.14 2.50 1.85 2.09 2.45 1.85 2.08 2.45 v i cc quiescent supply current (note 9) 30 60 90 30 60 90 30 60 90 ma v ih input voltage high 3770 4110 3870 4190 3940 4280 mv v il input voltage low 3050 3500 3050 3520 3050 3560 mv v ih input voltage high sel (note 10) 2.0 2.0 2.0 v v il input voltage low sel (note 10) 0.8 0.8 0.8 v v bb output reference voltage (note 6) 3.50 3.60 3.75 3.50 3.60 3.75 3.55 3.65 3.75 v i il input high current 150 150 150 a i ih input low current 0.5 0.5 0.5 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. input and output parameters will track 1:1 v cc . v ee can vary +0.5 v to ? 0.5 v. 7. qr outputs loaded with 50 to v cc ? 2.0 v 8. qt outputs loaded with 50 to v cc ? 3.0 v 9. outputs open circuited. 10. ttl signal threshold is 1.5 v above v ee .
mc10sx1190 http://onsemi.com 4 table 4. ac characteristics (v cc = 3.0 v to 5.5 v, v ee = 0 v) (note 11) ? 40 c 25 c to 85 c symbol characteristic min typ max min typ max unit t pd propagation delay ? to ? output dr qr (diff) (notes 12 and 13) 140 240 340 180 280 380 ps dr qt (diff) 300 400 500 350 470 650 dt qt (diff) 280 380 480 350 440 650 t plh , t phl propagation delay sel qt,qt (1.5 v to 50% pt) 400 700 1000 400 700 1000 ps t r , t f rise time (20% to 80%) qr,qr fall time (80% to 20%) 70 140 200 90 155 250 ps t r , t f rise time (20% to 80%) qt,qt fall time 80% to 20% 150 200 280 150 230 230 500 ps t skew within device skew (note 14) 15 15 ps v pp input swing (differential configuration) 200 1000 200 1000 mv v cmr common mode range (note 15) 3.0 4.35 3.0 4.35 v f max maximum operation frequency 2.5 2.5 gb/s note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. v ee can vary +0.3 v to ? 0.3 v 12. the differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 13. the single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the ou tput signal. 14. duty cycle skew is the difference between t plh and t phl propagation delay through a device. 15. the cmr range is referenced to the most positive side of the differential input signal. normal operation is obtained if the high level falls within the specified range and the peak-to-peak voltage lies between v pp min and 1.0 v.
mc10sx1190 http://onsemi.com 5 z o r pd v ee sx1190 qt r t = z o typical value for r pd is 160 to 260 , depending on the application. the minimum value of r pd should not be less than 50 . figure 3. sx1190 termination configuration z o r t qt r pd v ee z o r pd v ee qr z o r t qr r pd v ee z o r t v tt1 sx1190 qt r t = z o /2 z o qt r t v tt1 z o r t v tt2 qr z o qr r t v tt2 v tt1 = v cc ? 3 v v tt2 = v cc ? 2 v ordering information device package shipping ? mc10sx1190dt tssop ? 20* 75 units / rail mc10sx1190dtg tssop ? 20* 75 units / rail MC10SX1190DTR2 tssop ? 20* 2500 / tape & reel MC10SX1190DTR2g tssop ? 20* 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *this package is inherently pb ? free.
mc10sx1190 http://onsemi.com 6 package dimensions tssop ? 20 dt suffix plastic package case 948e ? 02 issue b dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . 110 11 20 pin 1 ident a b ? t ? 0.100 (0.004) c d g h section n ? n k k1 jj1 n n m f ? w ? seating plane ? v ? ? u ? s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 ??? ??? s u 0.15 (0.006) t on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 mc10sx1190/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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